《LED照明模组技术、产业及市场趋势-2017版》

[发表时间:2017年10月13日 12:33 来源:纸客帝国游戏 作者:纸客帝国游戏]

原标题:《LED照明模组技术、产业及市场趋势-2017版》

LED Lighting Module Technology, Industry and Market Trends 2017

在通用照明应用领域获得广泛应用之后,LED模组制造商正在寻求更高利润的新应用

受中等功率LED模组驱动,LED照明模组市场规模将在未来五年增长至目前的三倍

受益于集成厂商端的应用便利性,LED技术在通用照明领域的渗透率不断提高。受惠于此,LED照明模组市场的复合年增长率在2017~2022年间将达到22.6%。

中等功率LED几乎可以用于所有应用。因此,中等功率LED模组在2016年贡献了60%的市场营收,并将持续推动LED照明模组市场的增长。而高功率LED则仅用于小型模组中有高光通量要求的应用。因而,高功率LED模组的应用有限,仅占市场总营收的7%。

LED价值链中的LED模组

Chip-on-board(COB,板上芯片)LED模组在尺寸、光发射面(LES)、光通量和功耗方面取得了很好的平衡。因此,COB LED模组的应用很广,在出货量方面引领了整个LED模组市场。但是,由于这类模组的制造工艺相对简单,所以其平均销售价格相对较低。因此,COB LED模组的市场营收仅占总体市场的20%。

柔性LED灯带可以作为LED照明系统直接使用,主要应用于非直接照明领域。这些模组可以很方便的用于住宅照明和商业照明应用。近期的技术发展,如采用LED芯片代替封装好的LED应用在柔性衬底上,可以获得更高的能效,为线性照明等新应用打开了大门。

在这样的市场背景下,Yole预计2016年包括柔性LED灯带的LED照明模组市场规模接近40亿美元,到2022年将增长至138亿美元。

本报告深入分析了每种类型的LED模组,包括技术、趋势及市场规模。本报告提供了整个LED模组的产业现状,及其在通用照明领域的潜在应用。

2016~2022年全球LED照明模组市场营收预测

相关组件及材料,正获益于LED模组市场的增长

在LED光源中,LED模组通常包含光束成形、交直流电转换及提升散热效率的相关组件。LED模组中通常会应用二次配光元件(Secondary optics)来优化光的输出,并为产品带来更好的美学效果。目前主要有两类二次配光元件:准直器和反射器。第一类主要以阵列的形式应用于中等功率LED模组,或单个应用于高功率LED模组。第二类因其较大的光发射面(LES),通常用于COB LED模组。二次配光元件的市场营收在2016年达到了9亿美元,预计到2022年将增长至43亿美元。

Printed circuit boards(PCBs,印刷电路板)是影响LED模组性能和可靠性的基础材料。LED模组的散热管理,需要制作一条高效的热传导通路使模组保持安全、最优的温度范围。COB LED模组因其较高的功率密度,通常需要使用高性能PCB,如Metal Core PCBs(MCPCBs,金属芯PCB)或陶瓷PCB。但是,因为COB的尺寸较小,所以它们的高性能PCB的尺寸也很小。因而,PCB市场仍由中等功率LED模组主导,中等功率LED模组则需要FR4等低性能PCB材料。中等功率LED模组较大的尺寸,带来了最高的出货量和营收。预计到2022年,LED模组PCB整体的市场规模将增长至32亿美元。Thermal Interface Materials(TIM,热界面材料)和散热片等其它组件,在热传导通路中也很重要,但是它们带来的营收相对较小。

LED模组应用的五种主要PCB技术

本报告深入分析了和LED模组相关的不同功能组件,包括二次配光元件、PCB、TIM、散热片以及电源,并提供了和它们相关的市场信息,包括出货量和营收预测等。

LED模组中的主要功能组件

LED模组产业正寻求新的增长点,新应用不断涌现

通用照明市场由于巨大的价格压力和激烈的竞争,已经不再是“蓝海”。因此,LED模组制造商正在沿着已封装LED产业数年前的轨迹,寻求新的增长引擎。

因而,LED模组厂商正在多元化发展,不断探索园艺照明、汽车照明、智能照明等新应用,并跨越可见光进入红外(IR)或紫外(UV)光谱范围。这些新应用正快速兴起,相关利润远高于通用照明应用。这些应用中的LED模组所需要的技术含量较高。因此,瞄准这些新应用的LED模组制造商正押宝集成制造商并不具备所需要的技术能力,而较高的市场需求将帮助它们在价值链中获得更有利的位置。Everlight(亿光电子)便是一个很好的例子,它最初是一家光源供应商,随后开始开发COB技术。现在,亿光电子将自己定位为一家先进LED模组供应商,寻求进入汽车照明市场。

除了可见光LED,随着紫外治疗和红外监控摄像头等应用的快速增长,紫外和红外LED模组的应用也在增长。两种模组中都使用了大量LED,为保证模组的性能,热管理变得非常关键,尤其是对于紫外应用。

本报告探讨了LED模组市场的下一轮增长动力,并分析了相关目标应用。此外,本报告还概述了LED模组产业的未来发展趋势。

LED照明模组正从通用照明向其它应用多元化发展

报告涉及的部分厂商:Acclaim Lighting, American Bright LED, APT, BAG, BJB, Bridgelux, Brightview Electronic, Cambridge Nanotherm, Carclo, CETC Huaying Electronics, Citizen, Cree, CTL, Edison, Edlan Lighting Technology, Elemental LED, Epitex, Everlight, Flexfire LED, Fusion optix, Futuro Lighting, Gaggione, GE Lighting, Harvard, Harvatek, Heatron, Helio, Helvar, Honglitronic, Hueyjann, Hugewin, HuiYuan, Itswell, KKDC, Kodenshi, LED Linear, LED Waves, Ledil, Ledman, Ledtech, LEDtronics, Ledxon, Lextar, LG, Lighten Corp, Lightspot, Lucent Lighting, Lumens, Lumichip, Lumileds, Lumimodule, Luminus Devices, Lustrous Technology, LWF, Molex, Neonica Polska, Nichia, NVC Lighting Technology, OML Technology, Opple, Optogan, Osram, ParagonLED, Philips Lighting, Powerlightec, Prolight, Rishang Optoelectronics, Samsung, Seoul Semiconductor, Shanghai Toplight Tech, Sharp, Shenzen Lingbenyang Industry, Shenzen Rebow Industrial, Shenzhen Refond, Smart Systems Controls, Sunpu-Opto, TCI, TCL Lighting, Thomas Research Product, Toyoda Gosei, Universal LED Solution, Universal Lighting Technology, Vishay, Vossloh-Schwabe, Wen Run Optoelectronics, Wooree LED, Xicato, Yi Ji Xi Guang, and more...

报告目录:

What’s new?

Executive summary

LED module integration into lighting systems

> System Integration

> Engineering

> Thermal Integration

> Electrical Insulation Rules

- Overview- Details on Driver Classes

> Zhaga- Guideline for Interchangeability of Light Sources

- Consortium Members

- The Dilemma

- What’s New Since 2015?

LED module integration into lighting systems

> The Different Types of LED Modules

- Taxonomy- Middle Power vs. High Power vs. COB vs. AC vs. Custom vs. CSP

- Positioning with Integration of CSP LED

- Geometry and Size

- Electrical Interfaces

- LED Module vs. LEDi Module

> The Case of Flexible LED Strips

> LED Market Volume and Revenue

Analysis of LED lighting modules by function

> Main Functions in LED Modules

- System Structure

- Parameter Interdependence

- Why is Thermal Management Required for LED Systems?

> Optical Design

- A Large Panel of Optical Solutions

- Generic Optical Architecture in Lighting

- Focus on Reflectors- Collimators, Lenses and Refractors

- Materials and Processes

- Materials Overview

- Focus on Silicon Optics

- Mixing Chamber

- Other Types of Optics

- Harsh Environments

- Optical Architecture vs. LED Module Technology

- Mapping of Visible LED Players

- Market Overview

> Substrates/PCB

- Overview of Technologies

- FR4 vs MCPCB vs Ceramic

- Mapping of Players

- Market Overview

> Thermal Interface Materials

- Purpose and Role of TIM

- Criteria of Choice for a Thermal Interface Materia

- Different Types of TIM

- Materials Suppliers Overview

- Penetration Rate of TIM

- Market Overview

> Heatsink Technologies

- Introduction

- Active Cooling vs. Passive Cooling Solutions

- Recent Developments

- Mapping of Identified Players

- Origin of Players

> Power Supply and Drivers

- Overview of Drivers

- The Different Driver Topologies

- Driver Topology vs. LED Module Technology

- AC Drivers- Summary and Trends

Analysis of mid-power LED modules

> Drivers for Integration

> Why Mid-Power LEDs for LED Modules?

> Overview of Standard Design

> Type of LEDs

> Focus on CSP LED

> Performance Aspects

> Substrate/PCB

> Thermal Management and Reliability

> Power and Voltage

> Drivers

> Optics

> Focus on AC Mid

-Power LED Module

> Mid-Power LED Module Market Volume and Revenue

Analysis of high power LED modules

> Introduction

> The Different Types of High Power LED Modules

> High Brightness and Large (HBL) Modules

> High Quality of Light (HQL) Modules

> High Brightness and Compact (HBC) Modules

> High Power LED Module Market Volume and Revenue

Analysis of COB LED modules

> Introduction

> COB Technology

- A Compromise Solution

> Main COB Design Choices

> Trends

> High Lumen Density in COB

> Positioning of High Density COB

> Market Segmentation and Uses

> New COB Devices

> COB Evolution and Roadmap

> Ecosystem

> Interconnection

> Holder Reliability

> Diversity and Compatibility

> Standardization

> Zhaga Influence

> Optics

> Management of System Performance

> Drivers

> Thermal Management

> COB LED Module Market Volume and Revenue

Analysis of CSP LED modules

> Definition of CSP LED Devices

> Price Positioning of CSP LED Modules

> Impact of CSP LED Device on System/Module Design

> Opportunities for CSP LED Modules

> CSP LED System/Module Performance in Application

Analysis of flexible LED strips

> Flexible LED Strips at a Glance

> Flexible LED Strips vs. Rigid LED Strips

> Status of the Industry

> Differentiation Factors

> Voltage

> Connectors

> Dust and Water Protection

> Adhesive

> Recent Developments

> Flexible LED Module Market Volume and Revenue

LED module market

– summary

> Application vs Module Technology

> LED Module Market Volume and revenue

– Excluding Flexible LED Modules

> Total LED Module Market Revenue

LED lighting module industry and market trends

> Introduction

– Status of The Packaged LED Industry- Introduction to LEDs

- History of LED Industry

> Packaged LED Industry and Market Trends

- Focus on General Lighting Applications

- Focus on Automotive Lighting

- Focus on Horticultural Lighting

- LED Industry in 2017

- Main Challenges

Conclusions

Appendix

- definitions and uses of LED modules

Appendix

- LED lighting module industry trends

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